MPXM2010DT1 NXP Semiconductors
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Technische Details MPXM2010DT1 NXP Semiconductors
Description: SENSOR 1.45PSID .025V 5MPAK, Features: Temperature Compensated, Packaging: Tape & Reel (TR), Package / Case: 5-SMD Module, Output Type: Wheatstone Bridge, Mounting Type: Surface Mount, Output: 0 mV ~ 25 mV (10V), Operating Pressure: 1.45PSI (10kPa), Pressure Type: Differential, Accuracy: ±1%, Operating Temperature: -40°C ~ 125°C, Termination Style: Gull Wing, Voltage - Supply: 10V ~ 16V, Applications: Board Mount, Supplier Device Package: 5-MPAK, Port Style: No Port, Maximum Pressure: 10.88PSI (75kPa), Part Status: Obsolete.
Weitere Produktangebote MPXM2010DT1
Foto | Bezeichnung | Hersteller | Beschreibung |
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MPXM2010DT1 | Hersteller : NXP USA Inc. |
Description: SENSOR 1.45PSID .025V 5MPAK Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 5-SMD Module Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Differential Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) Part Status: Obsolete |
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MPXM2010DT1 | Hersteller : NXP Semiconductors | Board Mount Pressure Sensors M-PAK |
Produkt ist nicht verfügbar |