MPXM2202DT1

MPXM2202DT1 NXP Semiconductors


MPX2202-1127021.pdf Hersteller: NXP Semiconductors
Board Mount Pressure Sensors M-PAK
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Technische Details MPXM2202DT1 NXP Semiconductors

Description: SENSOR 29.01PSID .04V 5MPAK, Features: Temperature Compensated, Packaging: Tape & Reel (TR), Package / Case: 5-SMD Module, Output Type: Wheatstone Bridge, Mounting Type: Surface Mount, Output: 0 mV ~ 40 mV (10V), Operating Pressure: 29.01PSI (200kPa), Pressure Type: Differential, Operating Temperature: -40°C ~ 125°C, Termination Style: Gull Wing, Voltage - Supply: 10V ~ 16V, Applications: Board Mount, Supplier Device Package: 5-MPAK, Port Style: No Port, Maximum Pressure: 58.02PSI (400kPa), Part Status: Active.

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MPXM2202DT1 MPXM2202DT1 Hersteller : NXP USA Inc. MPX2202.pdf Description: SENSOR 29.01PSID .04V 5MPAK
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
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