Produkte > NXP USA INC. > MSC8103VT1100F

MSC8103VT1100F NXP USA Inc.

Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete

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Technische Details MSC8103VT1100F NXP USA Inc.

Description: IC DSP 16BIT 275MHZ 332FCBGA, Packaging: Tray, Package / Case: 332-BFBGA, FCBGA, Mounting Type: Surface Mount, Interface: Communications Processor Module (CPM), Type: SC140 Core, Operating Temperature: -40°C ~ 105°C (TJ), Non-Volatile Memory: External, On-Chip RAM: 512KB, Voltage - I/O: 3.30V, Voltage - Core: 1.60V, Clock Rate: 275MHz, Supplier Device Package: 332-FCBGA (17x17), Part Status: Obsolete.