MSC8113TMP3600V NXP USA Inc.
Hersteller: NXP USA Inc.Description: DSP TRI-CORE 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I²C, TDM, UART
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 300MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
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Technische Details MSC8113TMP3600V NXP USA Inc.
Description: DSP TRI-CORE 431FCBGA, Packaging: Tray, Package / Case: 431-BFBGA, FCBGA, Mounting Type: Surface Mount, Interface: Ethernet, I²C, TDM, UART, Type: SC140 Core, Operating Temperature: -40°C ~ 105°C (TJ), Non-Volatile Memory: External, On-Chip RAM: 1.436MB, Voltage - I/O: 3.30V, Voltage - Core: 1.10V, Clock Rate: 300MHz, Supplier Device Package: 431-FCPBGA (20x20), Part Status: Obsolete.