MSCDC100A70D1PAG MICROCHIP TECHNOLOGY
Hersteller: MICROCHIP TECHNOLOGYCategory: Diode modules
Description: Module: diode; double series; 700V; 100A; D1P; screw; screw; SiC
Max. off-state voltage: 700V
Load current: 100A
Semiconductor structure: double series
Electrical mounting: screw
Mechanical mounting: screw
Features of semiconductor devices: Schottky
Technology: SiC
Type of semiconductor module: diode
Case: D1P
Anzahl je Verpackung: 1 Stücke
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Technische Details MSCDC100A70D1PAG MICROCHIP TECHNOLOGY
Description: DIODE MODULE SIC 700V 100A D1P, Packaging: Box, Package / Case: Module, Mounting Type: Chassis Mount, Speed: No Recovery Time > 500mA (Io), Reverse Recovery Time (trr): 0 ns, Technology: SiC (Silicon Carbide) Schottky, Diode Configuration: 1 Pair Series Connection, Current - Average Rectified (Io) (per Diode): 100A, Supplier Device Package: D1P, Operating Temperature - Junction: -40°C ~ 175°C, Voltage - DC Reverse (Vr) (Max): 700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 100 A, Current - Reverse Leakage @ Vr: 400 µA @ 700 V.
Weitere Produktangebote MSCDC100A70D1PAG
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MSCDC100A70D1PAG | Hersteller : Microchip Technology |
Description: DIODE MODULE SIC 700V 100A D1P Packaging: Box Package / Case: Module Mounting Type: Chassis Mount Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 100A Supplier Device Package: D1P Operating Temperature - Junction: -40°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 700 V Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 100 A Current - Reverse Leakage @ Vr: 400 µA @ 700 V |
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MSCDC100A70D1PAG | Hersteller : Microchip Technology |
Diode Modules PM-DIODE-SIC-SBD-D1P |
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| MSCDC100A70D1PAG | Hersteller : MICROCHIP TECHNOLOGY |
Category: Diode modules Description: Module: diode; double series; 700V; 100A; D1P; screw; screw; SiC Max. off-state voltage: 700V Load current: 100A Semiconductor structure: double series Electrical mounting: screw Mechanical mounting: screw Features of semiconductor devices: Schottky Technology: SiC Type of semiconductor module: diode Case: D1P |
Produkt ist nicht verfügbar |