MSCDC200A70D1PAG Microchip Technology
Hersteller: Microchip Technology
Description: DIODE MODULE SIC 700V 200A D1P
Current - Average Rectified (Io) (per Diode): 200A
Diode Configuration: 1 Pair Series Connection
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Box
Current - Reverse Leakage @ Vr: 800 µA @ 700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 700 V
Part Status: Active
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: D1P
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Technische Details MSCDC200A70D1PAG Microchip Technology
Description: DIODE MODULE SIC 700V 200A D1P, Current - Average Rectified (Io) (per Diode): 200A, Diode Configuration: 1 Pair Series Connection, Technology: SiC (Silicon Carbide) Schottky, Reverse Recovery Time (trr): 0 ns, Speed: No Recovery Time > 500mA (Io), Mounting Type: Chassis Mount, Package / Case: Module, Packaging: Box, Current - Reverse Leakage @ Vr: 800 µA @ 700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 200 A, Voltage - DC Reverse (Vr) (Max): 700 V, Part Status: Active, Operating Temperature - Junction: -40°C ~ 175°C, Supplier Device Package: D1P.

