MSCDC300A70AG Microchip Technology
Hersteller: Microchip TechnologyDescription: DIODE MOD SIC SCHOTT 700V SP6
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 300A
Supplier Device Package: SP6
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A
Current - Reverse Leakage @ Vr: 1.2 mA @ 700 V
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 489.33 EUR |
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Technische Details MSCDC300A70AG Microchip Technology
Description: DIODE MOD SIC SCHOTT 700V SP6, Packaging: Tube, Package / Case: Module, Mounting Type: Chassis Mount, Speed: No Recovery Time > 500mA (Io), Reverse Recovery Time (trr): 0 ns, Technology: SiC (Silicon Carbide) Schottky, Diode Configuration: 1 Pair Series Connection, Current - Average Rectified (Io) (per Diode): 300A, Supplier Device Package: SP6, Operating Temperature - Junction: -40°C ~ 175°C, Voltage - DC Reverse (Vr) (Max): 700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A, Current - Reverse Leakage @ Vr: 1.2 mA @ 700 V.
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| MSCDC300A70AG | Hersteller : MICROCHIP TECHNOLOGY |
Category: Diode modules Description: Module: diode; double series; 700V; 300A; SP6C; screw; screw; SiC Max. off-state voltage: 700V Load current: 300A Semiconductor structure: double series Electrical mounting: screw Mechanical mounting: screw Features of semiconductor devices: Schottky Technology: SiC Type of semiconductor module: diode Case: SP6C |
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