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Technische Details MSCGL40X120T3AG Microchip Technology
Category: IGBT modules, Description: Module: IGBT; transistor/transistor; IGBT three-phase bridge, Electrical mounting: Press-in PCB, Mechanical mounting: screw, Topology: IGBT three-phase bridge; NTC thermistor, Technology: Trench, Type of module: IGBT, Max. off-state voltage: 1.2kV, Collector current: 40A, Case: SP3F, Semiconductor structure: transistor/transistor.
Weitere Produktangebote MSCGL40X120T3AG
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MSCGL40X120T3AG | Hersteller : MICROCHIP (MICROSEMI) |
 Category: IGBT modulesDescription: Module: IGBT; transistor/transistor; IGBT three-phase bridge Electrical mounting: Press-in PCB Mechanical mounting: screw Topology: IGBT three-phase bridge; NTC thermistor Technology: Trench Type of module: IGBT Max. off-state voltage: 1.2kV Collector current: 40A Case: SP3F Semiconductor structure: transistor/transistor |
Produkt ist nicht verfügbar |
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MSCGL40X120T3AG | Hersteller : Microchip / Microsemi |
Discrete Semiconductor Modules DOR CC3226 |
Produkt ist nicht verfügbar |
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| MSCGL40X120T3AG | Hersteller : MICROCHIP (MICROSEMI) |
Category: IGBT modules Description: Module: IGBT; transistor/transistor; IGBT three-phase bridge Electrical mounting: Press-in PCB Mechanical mounting: screw Topology: IGBT three-phase bridge; NTC thermistor Technology: Trench Type of module: IGBT Max. off-state voltage: 1.2kV Collector current: 40A Case: SP3F Semiconductor structure: transistor/transistor |
Produkt ist nicht verfügbar |