Technische Details NC2SW.015 1LB Chip Quik
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60, Packaging: Bulk, Diameter: 0.015" (0.38mm), Composition: Sn60Pb40 (60/40), Type: Wire Solder, Melting Point: 361°F ~ 370°F (183°C ~ 188°C), Form: Spool, 1 lb (453.592g), Process: Leaded, Flux Type: No-Clean, Part Status: Active.
Weitere Produktangebote NC2SW.015 1LB nach Preis ab 93.51 EUR bis 93.51 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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NC2SW.015 1LB | Chip Quik Inc. |
 Description: SOLDER WIRE 60/40 TIN/LEAD (SN60Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361°F ~ 370°F (183°C ~ 188°C) Form: Spool, 1 lb (453.592g) Process: Leaded Flux Type: No-Clean Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| NC2SW.015 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 93.51 EUR |