Technische Details NC2SWLF.015 4OZ Chip Quik
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Packaging: Bulk, Diameter: 0.015" (0.38mm), Composition: Sn99.3Cu0.7 (99.3/0.7), Type: Wire Solder, Melting Point: 441°F (227°C), Form: Spool, 4 oz (113.40g), Flux Type: No-Clean, Part Status: Active.
Weitere Produktangebote NC2SWLF.015 4OZ nach Preis ab 49.3 EUR bis 49.3 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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NC2SWLF.015 4OZ | Chip Quik Inc. |
 Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 4 oz (113.40g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| NC2SWLF.015 4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.3 EUR |