Technische Details NCSWLF.015 2OZ Chip Quik
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Packaging: Bulk, Diameter: 0.015" (0.38mm), Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Spool, 2 oz (56.70g), Flux Type: No-Clean, Part Status: Active.
Weitere Produktangebote NCSWLF.015 2OZ nach Preis ab 54.91 EUR bis 74.73 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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NCSWLF.015 2OZ | Chip Quik Inc. |
 Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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| NCSWLF.015 2OZ |
|
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 74.73 EUR |
| 5+ | 73.21 EUR |
| 10+ | 67.1 EUR |
| 25+ | 54.91 EUR |