NX3DV42GU33Z NXP USA Inc.
Hersteller: NXP USA Inc.
Description: NX3DV42GU33
Features: Break-Before-Make, USB 2.0
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
Description: NX3DV42GU33
Features: Break-Before-Make, USB 2.0
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 1
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Technische Details NX3DV42GU33Z NXP USA Inc.
Description: NX3DV42GU33, Features: Break-Before-Make, USB 2.0, Packaging: Tape & Reel (TR), Package / Case: 10-XFQFN, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Applications: USB, On-State Resistance (Max): 6.5Ohm, -3db Bandwidth: 950MHz, Supplier Device Package: 10-XQFN (1.4x1.8), Voltage - Supply, Single (V+): 3V ~ 4.3V, Switch Circuit: DPDT, Multiplexer/Demultiplexer Circuit: 2:1, Number of Channels: 1.
Weitere Produktangebote NX3DV42GU33Z
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| NX3DV42GU33Z | Hersteller : NXP Semiconductors |
 USB Switch ICs NX3DV42GU33 |
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