
NX3L2G66GM,125 NXP USA Inc.

Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
888+ | 0.57 EUR |
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Technische Details NX3L2G66GM,125 NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XQFNU, Packaging: Tape & Reel (TR), Package / Case: 8-XFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), On-State Resistance (Max): 750mOhm, -3db Bandwidth: 60MHz, Supplier Device Package: 8-XQFNU (1.6x1.6), Voltage - Supply, Single (V+): 1.4V ~ 4.3V, Charge Injection: 6pC, Crosstalk: -90dB @ 100kHz, Switch Circuit: SPST - NO, Multiplexer/Demultiplexer Circuit: 1:1, Channel-to-Channel Matching (ΔRon): 20mOhm, Switch Time (Ton, Toff) (Max): 23ns, 8ns, Channel Capacitance (CS(off), CD(off)): 35pF, Current - Leakage (IS(off)) (Max): 10nA, Part Status: Obsolete, Number of Circuits: 2.
Weitere Produktangebote NX3L2G66GM,125
Foto | Bezeichnung | Hersteller | Beschreibung |
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NX3L2G66GM,125 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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NX3L2G66GM,125 | Hersteller : NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 8-XQFNU (1.6x1.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 6pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 23ns, 8ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 2 |
Produkt ist nicht verfügbar |
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NX3L2G66GM,125 | Hersteller : NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 8-XQFNU (1.6x1.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 6pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 23ns, 8ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 2 |
Produkt ist nicht verfügbar |