OSD32MP157F-512M-EAA Octavo Systems LLC
Hersteller: Octavo Systems LLC
Description: SYSTEM IN A PACKAGE ( SIP)
Packaging: Tray
Connector Type: DSI
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Speed: 800MHz
RAM Size: 512MB
Operating Temperature: -20°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: STM32MP157F
Part Status: Active
Description: SYSTEM IN A PACKAGE ( SIP)
Packaging: Tray
Connector Type: DSI
Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
Speed: 800MHz
RAM Size: 512MB
Operating Temperature: -20°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: STM32MP157F
Part Status: Active
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 84+ | 111.07 EUR |
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Technische Details OSD32MP157F-512M-EAA Octavo Systems LLC
Description: SYSTEM IN A PACKAGE ( SIP), Packaging: Tray, Connector Type: DSI, Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm), Speed: 800MHz, RAM Size: 512MB, Operating Temperature: -20°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: STM32MP157F, Part Status: Active.
Weitere Produktangebote OSD32MP157F-512M-EAA
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| OSD32MP157F-512M-EAA | Hersteller : Octavo Systems | System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 20C to 85C |
Produkt ist nicht verfügbar |
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OSD32MP157F-512M-EAA | Hersteller : Octavo Systems | System-On-Modules - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 20 C to 85 C |
Produkt ist nicht verfügbar |