OSDZU3EG1-2G-BFA Octavo Systems LLC
Hersteller: Octavo Systems LLC
Description: SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR
Packaging: Tray
Connector Type: 600-BGA
Size / Dimension: 1.570" L x 0.807" W (40.00mm x 20.50mm)
Speed: 500MHz, 1.2GHz
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5F, ARM® Quad Cortex®-A53
Flash Size: 128MB
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Technische Details OSDZU3EG1-2G-BFA Octavo Systems LLC
Description: SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR, Packaging: Tray, Connector Type: 600-BGA, Size / Dimension: 1.570" L x 0.807" W (40.00mm x 20.50mm), Speed: 500MHz, 1.2GHz, RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: ARM® Cortex®-R5F, ARM® Quad Cortex®-A53, Flash Size: 128MB.
Weitere Produktangebote OSDZU3EG1-2G-BFA
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OSDZU3EG1-2G-BFA | Hersteller : Octavo Systems |
System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C |
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