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Technische Details PA0001 Chip Quik
Description: SOIC-8 TO DIP-8 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: SOIC, Part Status: Active.
Weitere Produktangebote PA0001 nach Preis ab 6.41 EUR bis 6.41 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0001 | Chip Quik Inc. |
 Description: SOIC-8 TO DIP-8 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 584 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0001 |
|
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 584 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.41 EUR |