PA0011C Chip Quik
Hersteller: Chip Quik
PCBs & Breadboards SOIC-28 to DIP-28 SMT Adapter (1.27 mm pitch, 600 mil body) Compact Series
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Technische Details PA0011C Chip Quik
Description: SOIC-28 TO DIP-28 SMT ADAPTER (1, Packaging: Bulk, Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, Part Status: Active.
Weitere Produktangebote PA0011C nach Preis ab 16.12 EUR bis 16.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0011C | Chip Quik Inc. |
Description: SOIC-28 TO DIP-28 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 251 Stücke: Lieferzeit 10-14 Tag (e) |
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| PA0011C |
|
Hersteller: Chip Quik Inc.
Description: SOIC-28 TO DIP-28 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-28 TO DIP-28 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 251 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.12 EUR |