PA0032C Chip Quik
Hersteller: Chip Quik
PCBs & Breadboards TSSOP-8 to DIP-8 SMT Adapter (0.65 mm pitch) Compact Series
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Technische Details PA0032C Chip Quik
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0., Packaging: Bulk, Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Weitere Produktangebote PA0032C nach Preis ab 11.38 EUR bis 11.38 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0032C | Chip Quik Inc. |
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 71 Stücke: Lieferzeit 10-14 Tag (e) |
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| PA0032C |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.38 EUR |