PA0033C Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
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Technische Details PA0033C Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER (, Packaging: Bulk, Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Weitere Produktangebote PA0033C nach Preis ab 12.04 EUR bis 12.04 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0033C | Chip Quik |
PCBs & Breadboards TSSOP-14 to DIP-14 SMT Adapter (0.65 mm pitch) Compact Series |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0033C |
|
Hersteller: Chip Quik
PCBs & Breadboards TSSOP-14 to DIP-14 SMT Adapter (0.65 mm pitch) Compact Series
PCBs & Breadboards TSSOP-14 to DIP-14 SMT Adapter (0.65 mm pitch) Compact Series
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 12.04 EUR |