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Technische Details PA0034 Chip Quik
Description: TSSOP-16 TO DIP-16 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Weitere Produktangebote PA0034 nach Preis ab 7.69 EUR bis 7.69 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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PA0034 | Chip Quik Inc. |
 Description: TSSOP-16 TO DIP-16 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 587 Stücke: Lieferzeit 10-14 Tag (e) |
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| PA0034 |
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auf Bestellung 100 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| PA0034 |
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Hersteller: Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 587 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.69 EUR |