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Technische Details PA0083 Chip Quik
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE, Packaging: Bulk, Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm), Material: FR4 Epoxy Glass, Number of Positions: 3, Pitch: 0.037" (0.95mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: SOT-23, TO-236, Part Status: Active.
Weitere Produktangebote PA0083 nach Preis ab 4.94 EUR bis 4.94 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0083 | Chip Quik Inc. |
 Description: SOT23/TO-236 TO DIP-4 SMT ADAPTEPackaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, TO-236 Part Status: Active |
auf Bestellung 111 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0083 |
|
Hersteller: Chip Quik Inc.
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
auf Bestellung 111 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.94 EUR |