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Technische Details PA0087 Chip Quik
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP, Packaging: Bulk, Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm), Material: FR4 Epoxy Glass, Number of Positions: 6, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: SC-70, SC-88, SOT-363, Part Status: Active.
Weitere Produktangebote PA0087 nach Preis ab 4.94 EUR bis 4.94 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0087 | Chip Quik Inc. |
 Description: SC70-6/SOT-363 TO DIP-6 SMT ADAPPackaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SC-88, SOT-363 Part Status: Active |
auf Bestellung 1924 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0087 |
|
Hersteller: Chip Quik Inc.
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SC-88, SOT-363
Part Status: Active
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SC-88, SOT-363
Part Status: Active
auf Bestellung 1924 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.94 EUR |