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Technische Details PA0089 Chip Quik
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP, Packaging: Bulk, Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: SOT-23, TSOT, Part Status: Active.
Weitere Produktangebote PA0089 nach Preis ab 5.71 EUR bis 5.71 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0089 | Chip Quik Inc. |
 Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAPPackaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, TSOT Part Status: Active |
auf Bestellung 434 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0089 |
|
Hersteller: Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TSOT
Part Status: Active
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TSOT
Part Status: Active
auf Bestellung 434 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.71 EUR |