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Technische Details PA0101 Chip Quik
Description: LGA-14 TO DIP-14 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 14, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: LGA, Part Status: Active.
Weitere Produktangebote PA0101
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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PA0101 | Chip Quik Inc. |
 Description: LGA-14 TO DIP-14 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| PA0101 |
|
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)