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Technische Details PA0152 Chip Quik
Description: MICROSMD-4 BGA-4 0.5 MM PITCH, Packaging: Bulk, Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm), Material: FR4 Epoxy Glass, Number of Positions: 4, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: MicroSMD, BGA, Part Status: Active.
Weitere Produktangebote PA0152
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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PA0152 | Chip Quik Inc. |
 Description: MICROSMD-4 BGA-4 0.5 MM PITCHPackaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PA0152 |
|
Hersteller: Chip Quik Inc.
Description: MICROSMD-4 BGA-4 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-4 BGA-4 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH