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Technische Details PA0154 Chip Quik
Description: MICROSMD-6 BGA-6 0.5 MM PITCH, Packaging: Bulk, Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm), Material: FR4 Epoxy Glass, Number of Positions: 6, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: MicroSMD, BGA, Part Status: Active.
Weitere Produktangebote PA0154 nach Preis ab 8.15 EUR bis 8.15 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0154 | Chip Quik Inc. |
 Description: MICROSMD-6 BGA-6 0.5 MM PITCHPackaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MicroSMD, BGA Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0154 |
|
Hersteller: Chip Quik Inc.
Description: MICROSMD-6 BGA-6 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-6 BGA-6 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.15 EUR |