PA0155-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: MICROSMD-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.054" L x 0.054" W (1.36mm x 1.36mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: MICROSMD-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: BGA
Inner Dimension: 0.054" L x 0.054" W (1.36mm x 1.36mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
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Technische Details PA0155-S Chip Quik Inc.
Description: MICROSMD-8 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: BGA, Inner Dimension: 0.054" L x 0.054" W (1.36mm x 1.36mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Number of Positions: 8.
Weitere Produktangebote PA0155-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
PA0155-S | Hersteller : Chip Quik | Sockets & Adapters MicroSMD-8 BGA-8 Stainless Steel Sten |
Produkt ist nicht verfügbar |