PA0155 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: MICROSMD-8 BGA-8 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
Description: MICROSMD-8 BGA-8 0.5 MM PITCH
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MicroSMD, BGA
Part Status: Active
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Technische Details PA0155 Chip Quik Inc.
Description: MICROSMD-8 BGA-8 0.5 MM PITCH, Packaging: Bulk, Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: MicroSMD, BGA, Part Status: Active.
Weitere Produktangebote PA0155
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0155 | Hersteller : Chip Quik | Sockets & Adapters MicroSMD-8 BGA-8 to DIP-8 SMT Adapter |
Produkt ist nicht verfügbar |