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Technische Details PA0186 Chip Quik
Description: TO-263-7 DDPAK/D2PAK TO DIP-14, Packaging: Bulk, Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 7, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TO-263 (DDPAK/D2PAK), Part Status: Active.
Weitere Produktangebote PA0186
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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PA0186 | Chip Quik Inc. |
 Description: TO-263-7 DDPAK/D2PAK TO DIP-14Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 7 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PA0186 |
|
Hersteller: Chip Quik Inc.
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH