PA0187-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TO-263-9 STENCIL
Number of Positions: 9
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Type: TO/DDPAK
Pitch: 0.038" (0.97mm)
Material: Stainless Steel
Packaging: Bulk
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Technische Details PA0187-S Chip Quik Inc.
Description: TO-263-9 STENCIL, Number of Positions: 9, Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm), Type: TO/DDPAK, Pitch: 0.038" (0.97mm), Material: Stainless Steel, Packaging: Bulk.
Weitere Produktangebote PA0187-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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PA0187-S | Hersteller : Chip Quik |
Sockets & Adapters TO-263-9 Stainless Steel Stencil |
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