PA0191-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
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Technische Details PA0191-S Chip Quik Inc.
Description: TSSOP-10-EXP-PAD STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: TSSOP, Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm), Number of Positions: 10.
Weitere Produktangebote PA0191-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0191-S | Hersteller : Chip Quik | Sockets & Adapters TSSOP-10-Exp-Pad Stainless Steel Sten |
Produkt ist nicht verfügbar |