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Technische Details PA0191 Chip Quik
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT, Packaging: Bulk, Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm), Material: FR4 Epoxy Glass, Number of Positions: 10, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSSOP.
Weitere Produktangebote PA0191 nach Preis ab 7.69 EUR bis 7.69 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0191 | Chip Quik Inc. |
 Description: TSSOP-10-EXP-PAD TO DIP-10 SMTPackaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP |
auf Bestellung 155 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0191 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
auf Bestellung 155 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.69 EUR |