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Technische Details PA0192 Chip Quik
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT, Packaging: Bulk, Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 14, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Weitere Produktangebote PA0192 nach Preis ab 8.63 EUR bis 8.63 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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PA0192 | Chip Quik Inc. |
 Description: TSSOP-14-EXP-PAD TO DIP-14 SMTPackaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PA0192 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.63 EUR |