Technische Details PA0193-S Chip Quik
Description: TSSOP-16-EXP-PAD STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.026" (0.65mm), Type: TSSOP, Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm), Number of Positions: 16.
Weitere Produktangebote PA0193-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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PA0193-S | Hersteller : Chip Quik Inc. |
 Description: TSSOP-16-EXP-PAD STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm) Number of Positions: 16 |
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