PA0194C Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.48 EUR |
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Technische Details PA0194C Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A, Packaging: Bulk, Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm), Number of Positions: 20, Pitch: 0.026" (0.65mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.