PA0196-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-64-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm)
Number of Positions: 64
Description: TSSOP-64-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm)
Number of Positions: 64
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details PA0196-S Chip Quik Inc.
Description: TSSOP-64-EXP-PAD STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: TSSOP, Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm), Number of Positions: 64.
Weitere Produktangebote PA0196-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
PA0196-S | Hersteller : Chip Quik | Sockets & Adapters TSSOP-64-Exp-Pad Stainless Steel Sten |
Produkt ist nicht verfügbar |