PA0196 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
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Technische Details PA0196 Chip Quik Inc.
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT, Packaging: Bulk, Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm), Material: FR4 Epoxy Glass, Number of Positions: 64, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSSOP.
Weitere Produktangebote PA0196
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0196 | Hersteller : Chip Quik | Sockets & Adapters TSSOP-64-Exp-Pad to DIP-64 SMT Adapter |
Produkt ist nicht verfügbar |