PA0206 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
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Technische Details PA0206 Chip Quik Inc.
Description: DFN-16-EXP-PAD TO DIP-20 SMT, Packaging: Bulk, Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: DFN, Part Status: Active.
Weitere Produktangebote PA0206
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0206 | Hersteller : Chip Quik | Sockets & Adapters DFN-16-Exp-Pad to DIP-20 SMT Adapter |
Produkt ist nicht verfügbar |