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Technische Details PA0244 Chip Quik
Description: TO-252-5 DPAK TO DIP-10 SMT ADAP, Packaging: Bulk, Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm), Material: FR4 Epoxy Glass, Number of Positions: 5, Pitch: 0.045" (1.14mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TO-252 (DPAK).
Weitere Produktangebote PA0244
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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PA0244 | Chip Quik Inc. |
 Description: TO-252-5 DPAK TO DIP-10 SMT ADAPPackaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.045" (1.14mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-252 (DPAK) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| PA0244 |
|
Hersteller: Chip Quik Inc.
Description: TO-252-5 DPAK TO DIP-10 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.045" (1.14mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-252 (DPAK)
Description: TO-252-5 DPAK TO DIP-10 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.045" (1.14mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-252 (DPAK)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)