Q3-0.005-00-105 Bergquist
Hersteller: Bergquist
Description: THERM PAD 36.83X21.29MM BLACK
Outline: 36.83mm x 21.29mm
Usage: SIP
Thermal Resistivity: 0.35°C/W
Type: Pad, Sheet
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Elastomer
Color: Black
Packaging: Bulk
Backing, Carrier: Fiberglass
Thermal Conductivity: 2.0W/m-K
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Technische Details Q3-0.005-00-105 Bergquist
Description: THERM PAD 36.83X21.29MM BLACK, Outline: 36.83mm x 21.29mm, Usage: SIP, Thermal Resistivity: 0.35°C/W, Type: Pad, Sheet, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Elastomer, Color: Black, Packaging: Bulk, Backing, Carrier: Fiberglass, Thermal Conductivity: 2.0W/m-K.
Weitere Produktangebote Q3-0.005-00-105
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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Q3-0.005-00-105 | Hersteller : Bergquist Company |
Thermal Interface Products Glass-Reinforced Grease Replacement Thermal Interface, 0.005" Thickness, Sil-Pad TSP Q2000 Series / Also Known as Bergquist Q-Pad 3 Series |
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