QFS-032-04.25-L-D-DP-A-GP Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 10mm, 11mm, 14mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.278" (7.06mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 64
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Female
Features: Board Guide, Ground Bus (Plane), Mating Guide
Packaging: Tray
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Technische Details QFS-032-04.25-L-D-DP-A-GP Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 10mm, 11mm, 14mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.278" (7.06mm), Pitch: 0.025" (0.64mm), Number of Positions: 64, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Female, Features: Board Guide, Ground Bus (Plane), Mating Guide, Packaging: Tray.
Weitere Produktangebote QFS-032-04.25-L-D-DP-A-GP
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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QFS-032-04.25-L-D-DP-A-GP | Samtec |
 Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| QFS-032-04.25-L-D-DP-A-GP |
|
Hersteller: Samtec
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH