QFS-032-04.25-L-D-DP-A-GP Samtec
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Technische Details QFS-032-04.25-L-D-DP-A-GP Samtec
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Mating Guide, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 10mm, 11mm, 14mm, Number of Rows: 2.
Weitere Produktangebote QFS-032-04.25-L-D-DP-A-GP
| Foto | Bezeichnung | Hersteller | Beschreibung |
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QFS-032-04.25-L-D-DP-A-GP | Hersteller : Samtec |
 Conn Micro High Speed Socket Strip SKT 64 POS 0.635mm Solder ST SMD Tray |
Produkt ist nicht verfügbar |
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QFS-032-04.25-L-D-DP-A-GP | Hersteller : Samtec |
Conn Micro High Speed Socket Strip SKT 64 POS 0.635mm Solder ST SMD Tray |
Produkt ist nicht verfügbar |
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| QFS-032-04.25-L-D-DP-A-GP | Hersteller : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 64P SMD GOLD Packaging: Tray Features: Board Guide, Ground Bus (Plane), Mating Guide Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 64 Pitch: 0.025" (0.64mm) Height Above Board: 0.278" (7.06mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 10mm, 11mm, 14mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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QFS-032-04.25-L-D-DP-A-GP | Hersteller : Samtec |
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip |
Produkt ist nicht verfügbar |