QFS-032-04.25-L-D-DP-PT8 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Bulk
Features: Ground Bus (Plane), Power Pins (16)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 80 (64 + 16 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 10mm, 11mm, 14mm
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Bulk
Features: Ground Bus (Plane), Power Pins (16)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 80 (64 + 16 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 10mm, 11mm, 14mm
Number of Rows: 2
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Technische Details QFS-032-04.25-L-D-DP-PT8 Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Bulk, Features: Ground Bus (Plane), Power Pins (16), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 80 (64 + 16 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 10mm, 11mm, 14mm, Number of Rows: 2.
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QFS-032-04.25-L-D-DP-PT8 | Hersteller : Samtec |
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