QMS-016-01-H-D-DP-RA-MG Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P R/A GOLD
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.320" (8.12mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 32
Mounting Type: Surface Mount, Right Angle; Through Hole
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Ground Bus (Plane), Mating Guide
Packaging: Tray
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Technische Details QMS-016-01-H-D-DP-RA-MG Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P R/A GOLD, Number of Rows: 2, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.320" (8.12mm), Pitch: 0.025" (0.64mm), Number of Positions: 32, Mounting Type: Surface Mount, Right Angle; Through Hole, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Ground Bus (Plane), Mating Guide, Packaging: Tray.
Weitere Produktangebote QMS-016-01-H-D-DP-RA-MG
| Foto | Bezeichnung | Hersteller | Beschreibung |
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QMS-016-01-H-D-DP-RA-MG | Samtec | Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| QMS-016-01-H-D-DP-RA-MG |
Hersteller: Samtec
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH