QMS-016-06.75-L-D-DP-A-K Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 11mm, 13mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.250" (6.35mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 32
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Ground Bus (Plane), Pick and Place
Packaging: Tray
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Technische Details QMS-016-06.75-L-D-DP-A-K Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 11mm, 13mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.250" (6.35mm), Pitch: 0.025" (0.64mm), Number of Positions: 32, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Ground Bus (Plane), Pick and Place, Packaging: Tray.
Weitere Produktangebote QMS-016-06.75-L-D-DP-A-K
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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QMS-016-06.75-L-D-DP-A-K | Samtec |
 Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| QMS-016-06.75-L-D-DP-A-K |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH