Produkte > SAMTEC INC. > QSE-028-01-H-D-DP-A-K-TR

QSE-028-01-H-D-DP-A-K-TR Samtec Inc.


qse.pdf Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 56P SMD GOLD
Features: Board Guide, Ground Bus (Plane), Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Part Status: Active
Number of Rows: 2
auf Bestellung 524 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.92 EUR
10+ 29.28 EUR
25+ 28.18 EUR
50+ 27.49 EUR
100+ 21.06 EUR
250+ 18.92 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details QSE-028-01-H-D-DP-A-K-TR Samtec Inc.

Description: CONN DIFF ARRAY RCP 56P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Ground Bus (Plane), Pick and Place, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 56, Pitch: 0.031" (0.80mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm, Part Status: Active, Number of Rows: 2.

Weitere Produktangebote QSE-028-01-H-D-DP-A-K-TR

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QSE-028-01-H-D-DP-A-K-TR Hersteller : Samtec Inc. qse.pdf Description: CONN DIFF ARRAY RCP 56P SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Ground Bus (Plane), Pick and Place
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
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