QSS-032-01-L-D-DP-LC Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Features: Board Lock, Ground Bus (Plane)
Packaging: Tray
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.143" (3.63mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Features: Board Lock, Ground Bus (Plane)
Packaging: Tray
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.143" (3.63mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm
Number of Rows: 2
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Technische Details QSS-032-01-L-D-DP-LC Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Features: Board Lock, Ground Bus (Plane), Packaging: Tray, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.143" (3.63mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 5mm, Number of Rows: 2.
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