Technische Details QSS-032-01-L-D-DP Samtec
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Tray, Features: Ground Bus (Plane), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.143" (3.63mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 5mm, Number of Rows: 2.
Weitere Produktangebote QSS-032-01-L-D-DP
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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| QSS-032-01-L-D-DP | Hersteller : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 64P SMD GOLD Packaging: Tray Features: Ground Bus (Plane) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 64 Pitch: 0.025" (0.64mm) Height Above Board: 0.143" (3.63mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 5mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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QSS-032-01-L-D-DP | Hersteller : Samtec | Headers & Wire Housings 0.635 mm Q Strip High-Speed Ground Plane Socket Strip |
Produkt ist nicht verfügbar |