QTE-014-01-H-D-DP-A Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 28P SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.168" (4.27mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 28
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Ground Bus (Plane)
Packaging: Tray
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Technische Details QTE-014-01-H-D-DP-A Samtec Inc.
Description: CONN DIFF ARRAY PLG 28P SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 5mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.168" (4.27mm), Pitch: 0.031" (0.80mm), Number of Positions: 28, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Ground Bus (Plane), Packaging: Tray.
Weitere Produktangebote QTE-014-01-H-D-DP-A
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| QTE-014-01-H-D-DP-A | Hersteller : Samtec |
Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Terminal Strip |
auf Bestellung 192 Stücke: Lieferzeit 10-14 Tag (e) |