QTE-028-08-F-D-DP-A Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Number of Rows: 2
Contact Finish Thickness: 3.00µin (0.076µm)
Height Above Board: 1.151" (29.24mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 56
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Ground Bus (Plane)
Packaging: Tray
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Technische Details QTE-028-08-F-D-DP-A Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD, Number of Rows: 2, Contact Finish Thickness: 3.00µin (0.076µm), Height Above Board: 1.151" (29.24mm), Pitch: 0.031" (0.80mm), Number of Positions: 56, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Ground Bus (Plane), Packaging: Tray.
Weitere Produktangebote QTE-028-08-F-D-DP-A
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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QTE-028-08-F-D-DP-A | Samtec |
 Board to Board & Mezzanine Connectors Q Strip(R) High-Speed Ground Plane Header |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| QTE-028-08-F-D-DP-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Q Strip(R) High-Speed Ground Plane Header
Board to Board & Mezzanine Connectors Q Strip(R) High-Speed Ground Plane Header
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH