
R7F701372AEABG-C#BC1 Renesas Electronics Corporation

Description: IC MCU 32BIT 4MB FLASH 292FBGA
Packaging: Tray
Package / Case: 292-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1.0625M x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3M
Data Converters: A/D 32x12b
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, CSI, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 292-FBGA (17x17)
Part Status: Active
auf Bestellung 645 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 59.00 EUR |
10+ | 47.93 EUR |
25+ | 45.16 EUR |
100+ | 42.12 EUR |
250+ | 40.67 EUR |
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Technische Details R7F701372AEABG-C#BC1 Renesas Electronics Corporation
Description: IC MCU 32BIT 4MB FLASH 292FBGA, Packaging: Tray, Package / Case: 292-FBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 1.0625M x 8, Operating Temperature: -40°C ~ 150°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: RH850G3M, Data Converters: A/D 32x12b, Core Size: 32-Bit Quad-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, CSI, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART, Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Supplier Device Package: 292-FBGA (17x17), Part Status: Active.
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R7F701372AEABG-C#BC1 | Hersteller : Renesas Electronics |
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